发明名称 Handling system for assembly of SMD devices onto printed circuit board - has suction pad gripper used to extract components from magazine under control of optical viewing system
摘要 The handling system is used to provide automatic transfer and positioning of surface mount electronic devices (54) onto pads (53)C) formed on the surface of a printed circuit board (53). The board is held in a fixture (76) on a base plate (3) fixed to a main machine frame (7). Devices are supplied in a magazine (58) that can move in guides (79). The devices are extracted from the magazine by a suction head attached to an arm (16). The arm projects from a main housing (11) and can be moved in XY and Z directions. An optical system (45) provides an enlarged view of the device for improved handling. ADVANTAGE - Provides accurate position control.
申请公布号 DE4127696(A1) 申请公布日期 1993.02.25
申请号 DE19914127696 申请日期 1991.08.21
申请人 FRITSCH, ADALBERT, 8455 KASTL, DE 发明人 FRITSCH, ADALBERT, 8455 KASTL, DE
分类号 H05K13/00;H05K13/04 主分类号 H05K13/00
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