发明名称 |
Prodn. of polyimide endless band having no weld joins - by coating polyamide acid soln. on hollow glass cylinder having pre-determined inner dia. and length, heating, and removing band by hydrothermal treatment |
摘要 |
Prodn. comprises coating a hollow glass cylinder having a pre determined inner dia. and length at least on the inner side with a polyamide acid soln. which is heated to convert it to polyimide. The polyimide is then detached from the cooled cylinder by hydrothermal treatment to obtain a polyimide endless band. ADVANTAGE - The endless band has no glued join as in prior art bands which is a source of weakness
|
申请公布号 |
DE4127952(A1) |
申请公布日期 |
1993.02.25 |
申请号 |
DE19914127952 |
申请日期 |
1991.08.23 |
申请人 |
SIEMENS AG, 8000 MUENCHEN, DE |
发明人 |
BEIL, GERHARD, DIPL.-CHEM., 8058 ERDING, DE |
分类号 |
B29D29/00 |
主分类号 |
B29D29/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|