SEMICONDUCTION WAFER ADHERING METHOD

摘要

PURPOSE:To enhance the flatness of a polished wafer remarkably by heating a vacuum suction jig up to a temp. approx. the same as a rotary disc for polishing, and thereby making uniform the thickness of an adhesive agent layer at the time of adhesion for provisional attachment. CONSTITUTION:At the time of polishing, a semiconductor wafer 5, it is provisionally attached to a rotary disc for polishing 6 with a thermoplastic adhesive 4. Therein a vacuum attraction jig 2 for attracting the wafer 5 and affixing to the rotary disc 6 is heated to a temp. approx. the same as that of the rotary disc 6 which has been heated. This makes uniform the temp. distribution over the wafer surface placed on the rotary disc 6 when the affixation is conducted and also makes uniform the melding velocity of the adhesive 4 to lead to generation of uniform thickness of the adhesive agent layer, which should enhance the flatness of the wafer 5 on the disc 6. This causes in turn a remarkable enhancement of the flatness of the polished wafer.