| 摘要 |
<p>PURPOSE:To provide a wafer boat processing device, which can make processing of a wafer detaining groove uniformly in a wafer support of the wafer boat even though the support is dislocated. CONSTITUTION:The body of a wafer boat processing device is equipped with a sensor unit 10, in which a probe 16 is mounted at the tip of a stylus 15. Prior to processing, this probe 16 is touched to wafer supporting rods 51, 52, 53, 54 of the wafer boat 50, and the positions are sensed. The moving path of a grinder element G is corrected on the basis of the obtained position data for these supporting rods.</p> |
