| 摘要 |
PURPOSE:To simplify the stopper joining process and the dicing process by applying etching processing to an upper stopper to form a clearance, and forming a through hole at a position corresponding to a pad. CONSTITUTION:Etching is applied to an upper stopper 1 to form a window hole 6 of a pad part at a first stage, and next, etching is performed to form a clearance 10. In a lower stopper 7, a constant space 11 is formed by etching. At the time of dicing a sensor chip, scaling is performed at the window hole 6 for a pad 3 to cut two layers of a sensor wafer 2 and the lower stopper 7 at a virtual scribe line 5. Scaling of the upper stopper 1 and the sensor wafer 2 is thereby facilitated, and while since half scribe for forming an opening at a position corresponding to the pad 3 is not necessary, non-requirement factor at the process of stopper jointing and dicing is reduced to improve the workability. |
