<p>A high frequency module is disclosed which comprises a high frequency device (2) in a package (3), a circuit (100) formed on a flexible substrate (7) in the package, the circuit, the high frequency device and input/output terminals (12) of the package being connected electrically. <IMAGE></p>
申请公布号
EP0527468(A1)
申请公布日期
1993.02.17
申请号
EP19920113663
申请日期
1992.08.11
申请人
HITACHI, LTD.;HITACHI DENSHI KABUSHIKI KAISHA;HITACHI VIDEO & INFORMATION SYSTEM, INC.
