发明名称 |
Method and system for removing resin bleed from electronic components |
摘要 |
Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.
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申请公布号 |
US5186797(A) |
申请公布日期 |
1993.02.16 |
申请号 |
US19910640053 |
申请日期 |
1991.02.13 |
申请人 |
FUTURE AUTOMATION, INC. |
发明人 |
SCHLENKER, HEINZ W.;HIRBOUR, LOUIS J.;GRAMAROSSA, DANIEL J. |
分类号 |
C25F1/00;C25F5/00;C25F7/00 |
主分类号 |
C25F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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