| 摘要 |
PURPOSE:To alleviate mechanical and thermal impacts to be applied to a bonded portion by forming auxiliary fittings in a frame of a hybrid integrated circuit device having a part clamping frame, thereby completely bonding the frame to a packing. CONSTITUTION:A part clamping frame 1 and a packing 2a are bonded with an adhesive 3, and auxiliary fittings 5 are mounted in the frame 1. A hybrid integrated circuit device is placed on a printed board 7, and the fittings 5 mounted in the frame 1 are secured by soldering to the board 7 similarly to a lead terminal 2b. Thus, the frame 1 can be completely bonded to the packing 2a. |
