| 摘要 |
<p>PURPOSE:To provide a multichip module board which is lessened in signal delay so as to cope with a semiconductor device which operates at a high speed and enhanced in heat dissipating properties, where the multichip module board is formed by laminating conductor layers in layers through the intermediary of insulator and mounted with semiconductor chips. CONSTITUTION:Conductor layers 2 are laminated in layers on a board 1 through the intermediary of insulators 3 and 4 for the formation of a muiltichip module board, the insulator region 3 whose upside is covered with the conductor layer 2 is formed of insulator low in dielectric constant, and the other insulator region 4 is formed o insulator large in thermal conductivity and small in thermal expansion coefficient.</p> |
