| 摘要 |
The invention relates to integrated circuit chips and their application to a chip card with several chips. In order to simplify the mounting of the chips (CI1, CI2, CI3, CI4) in a card including several chips, and in particular to attempt to limit the printed connections to a single level in the card, the following system is proposed according to the invention: - the majority of the lands of the chips are split into a land A and a land B, each situated on one side of the periphery of the chip; - the two lands are short-circuited within the chip. In this way, two adjacent chips can be connected without crossing of interconnections, by using the lands which are on the appropriate side. The crossings are transferred to within the chips, which in any event include several interconnection levels. <IMAGE> |
