| 摘要 |
<p>PURPOSE:To reduce dent of through hole by forming metallic thin films of paradium, etc., by the sputtering method on both front and rear surfaces of a glass ceramics multilayer wiring substrate. CONSTITUTION:A paradium thin film 2 is formed by the sputtering method on both front and rear surfaces of a glass ceramics multilayer wiring board 1 having completed the necessary processings. Thereby, a metal conductor (silver) buried within a through hole 3 can be protected from exposure under the atmospheric condition. Next, the glass ceramics multilayer wiring board 1 is placed on an alumina setter 6 which is aligned for flatness and it is then put into a baking furnace under this condition for the heat treatment. Next, the paradium thin film 2 formed as the preprocessing is removed with an ion beam etching apparatus. Thereby, a glass ceramics multilayer wiring board using silver as wiring conductor can be completed without any dent of through hole.</p> |
