| 摘要 |
PURPOSE:To shorten sucking-mounting time of an electronic component by identifying a sucked state of the component in a step of moving a board from a component sucking position to a component mounting position. CONSTITUTION:After a large-sized electronic component 21 is sucked by a suction nozzle 4, a movable mirror 3 is moved rightward by a movable mirror moving mechanism while rising the nozzle 4 up to a height H1 by a rotating, rising and sucking mechanism. Then, rising of the nozzle 4 is stopped, and a component sucked state is identified by the mirror 3, a stationary mirror 2, a first half mirror 10 and a first camera 14. Then, the mirror 3 is retreated to an original position by a moving mechanism. And, after the nozzle 4 is moved down by a sucking mechanism until the component 21 is brought into contact with a mounting position of a printed board 31, sucking of the component 21 is released, and mounted at a predetermined position of the board 31. Thus, the mounting time of the component can be shortened. |
