发明名称 NEGATIVE PHOTOSENSITIVE COMPOSITION
摘要 PURPOSE:To obtain the composition in which exposure reaches the lower part of a resist film and which is sufficiently cured and to obtain an excellent pattern profile by forming the alkalisoluble resin with a polymer having a specified structural unit. CONSTITUTION:This composition contains an alkali-soluble resin, a acid photozeurator and a cross-linking agent for the alkali-soluble resin acting in acidic condition. The alkali-soluble resin consists of a polymer having a vinylphenol structural unit shown by formula II, and the polymer is synthesized by the decomposition reaction of an alkoxycarbonyl group of a polymer having a structural unit shown by formula I. In formulas I and II, R<1> is hydrogen atom or an alkyl, and R<2> is an alkyl. Besides, hydrogen atom is preferably used as R<1> and t-butyl as R<2>.
申请公布号 JPH0534923(A) 申请公布日期 1993.02.12
申请号 JP19910215803 申请日期 1991.07.31
申请人 MITSUBISHI KASEI CORP 发明人 OCHIAI TAMEICHI;TAKAHASHI NORIAKI;KAMEYAMA YASUHIRO
分类号 G03F7/004;G03F7/029;G03F7/038;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址