VERFAHREN ZUM HERSTELLEN EINES HALBLEITERAPPARATES MIT ZWEI HALBLEITERANORDNUNGEN.

摘要

Disclosed is a method of realizing high-density and inexpensive semiconductor apparatus by joining the electrodes of two semiconductor devices. A metal bump formed on a substrate is transferred and joined onto the electrode of first semiconductor device, and electrode of second semiconductor device and the metal bump transferred and joined on the first semiconductor device are positioned, pressed and heated, thereby joining the two semiconductor devices together.