发明名称 |
SEMICONDUCTOR DEVICE HAVING MANY LEAD PINS |
摘要 |
<p>A semiconductor device with a high package lead density such as the PGA type, allowing the density of the semiconductor device to increase by forming the leads of the semiconductor device with lead pins (14) for surface mounting arranged by the specified quantity at the outer peripheral area on the back of a package (13) where a chip (11) is mounted and lead members (22 and 41) having the predetermined function at least one of which is arranged at the internal area other than the area of the above lead pins (14). <IMAGE></p> |
申请公布号 |
EP0504411(A4) |
申请公布日期 |
1993.02.10 |
申请号 |
EP19910916592 |
申请日期 |
1991.09.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
TANIZAWA, TETSU, FUJITSU LIMITED |
分类号 |
H01L21/60;H01L23/04;H01L23/057;H01L23/498;H05K3/34;(IPC1-7):H01L23/50;H01L23/12 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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