发明名称 |
METHOD OF COATING FACET OF SEMICONDUCTOR OPTICAL ELEMENT |
摘要 |
A method of selectively coating one of two spaced apart facets of respective light-emitting regions on the same surface of a semiconductor device formed in a semiconductor wafer includes forming at least one first groove in a wafer and forming at least one second groove in the wafer intersecting the first groove, exposing light-emitting region facets on a side wall surface of the second groove. A stream of an evaporated coating material is directed across an edge, formed by the intersection of a side wall surface of the second groove with the first groove, at an angle relative to the wafer surface so that the edge shadows one of the light-emitting region facets but not the other. After the coating process, the wafer is divided into individual devices that may include adjacent, differently coated light-emitting region facets. The invention avoids a mechanical mask alignment step by employing in the coating process first grooves that are self aligning relative to the light-emitting region facets.
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申请公布号 |
US5185290(A) |
申请公布日期 |
1993.02.09 |
申请号 |
US19900561720 |
申请日期 |
1990.08.01 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
AOYAGI, TOSHITAKA;SHIGIHARA, KIMIO |
分类号 |
H01S5/00;H01S5/02;H01S5/028;H01S5/40 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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