| 发明名称 |
SUBSTRATE FOR HYBRID INTEGRATED CIRCUIT |
| 摘要 |
PURPOSE:To improve boundary adhesive strength of an aluminum/copper clad foil in a circuit board. CONSTITUTION:As for a circuit board wherein an aluminum/copper clad foil 4 is laminated on a metal substrate 1 with an insulative layer 2 in between, a zinc or a tin is provided on a clad foil boundary by means of substitution. |
| 申请公布号 |
JPH0529741(A) |
申请公布日期 |
1993.02.05 |
| 申请号 |
JP19910206148 |
申请日期 |
1991.07.24 |
| 申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
FUKUDA MAKOTO;YONEMURA NAOKI;WATANABE CHIHARU |
| 分类号 |
H01L23/14;H05K1/05;H05K1/09 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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