| 摘要 |
PURPOSE:To realize an IC package which is free from imperfect sealing, can be reduced in thickness, and is provided with heat sinks by arranging the heat sinks on the side face of an IC chip so as to thermally connect the IC chip to a lead frame. CONSTITUTION:An IC chip 1 is fixed to the internal walls of through holes 2a formed through heat sinks 2 with a bonding agent 6 and the heat sinks 2 are stuck to an inner lead 4 through an insulating film 7 having an adhesive property on both surfaces. The IC chip 1 and heat sinks 2 are enclosed in a molded resin 5 together with bonding wires 3 and inner lead 4. Since this IC package has a three-layer structure in a cross section cut through the chip 1 and the height of the wires 3 can be reduced, the whole thickness of the package can be reduced. In addition, both surfaces of the chip 1 and heat sinks 2 are coated with the molded resin, the chip 1 and heat sinks 2 can be completely sealed. |
