MEASURING APPARATUS OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To perform a measuring operation whose irregularity is small by providing the following: a printed-circuit board in which a transistor-package mounting part has been bored; a metal heat sink which is brought into close contact with the printedcircuit board and in which at least one hole for vacuum suction use has been formed in the bored part in said printed-circuit board; and an insulating rod. CONSTITUTION:Insulating rods 7 press lead parts 6 to a printedcircuit board 2. A hole 12 for vacuum suction use is made in the bored part in the printed- circuit board 2 of a metal heat sink 11. Since a heat sink part 3 in a transistor package is vacuum-sucked by using the hole 12 for vacuum suction use, a compression-bonding force becomes sufficient and definite. Since sufficient heat is made to escape to the metal heat sink 11 from the heat sink part 3, a measuring operation whose irregularity is small can be performed irrespective of whether output electric power is large or small. Since the package is fixed and bonded by a force which is independent of that of the insulating rods 7 pressing the lead parts 6, the influence of a warp and a bend at the lead parts 6 is reduced. Thereby, it is possible to perform the measuring operation whose irregularity is small.