| 摘要 |
PURPOSE:To realize a TAB tape carrier which can cope with miniaturization of inner leads or high accuracy of a pattern by providing a ceramic layer under a copper foil for forming the leads of at least a device hole. CONSTITUTION:Alumina is flame sprayed on a roughed surface of an electrolytic copper foil 1 by using a plasma flame sprayer to form an alumina flame sprayed layer 2. After the layer 2 is coated with epoxy resin adhesive 3, a polyimide film 4 formed with sprocket holes, a device hole, is thermally press-bonded. Thus, widths, a pitch of inner leads by thinning the foil can be shortened. Further, since a thermal expansion coefficient of a TAB tape carrier can be suppressed to a low value, dimensional stability can significantly be improved. Accordingly, it can cope with miniaturization of the carrier. |
