| 摘要 |
PURPOSE: To provide a large power semiconductor device, for which cooling performance is improved and simple housing is provided. CONSTITUTION: In a large power semiconductor device, contact filaments 3a and 3b, forming cooling channels 11a and 11b which are arranged in the form of brush so as to circulate a cooling material between them are contacted with a semiconductor wafer 1, by physically continued bonding so that cooling operation is improved. |
