| 摘要 |
PURPOSE:To enable a dam bar to be removed without using a punch when the dam bar is removed after a device is sealed up with resin. CONSTITUTION:A lead frame 1 is composed of a lead frame body 1a and a dam bar 6 separately provided from the lead frame body. The lead frame body 1a is usually provided with a die pad 3, inner leads 4, outer leads 5, and a dam bar, but a dam bar is not provided in some cases, and then a dam bar is formed of metal plate of copper alloy or 42Ni-Fe alloy through etching or stamping. The dam bar 6 is formed of insulating organic resin as separated from the lead frame ' body 1a and provided to the lead frame body 1a at a prescribed position. The dam bar 6 is removed with a dedicated releasing liquid after a semiconductor element 2 is mounted. |
