| 摘要 |
<p>PURPOSE:To eliminate the need for the adjustment of the electrical characteristics of a chip type electronic part after baking even when a substrate is baked at a high temperature, and to improve the accuracy of a circuit board by inserting the electronic component into an inserting hole formed to the substrate. CONSTITUTION:Each laminated substrate 11 is separated, and hole sections such as approximately rectangular inserting holes 15, into which chip resistors R, etc., are inserted, approximately circular via holes 16 or the like are bored at every substrate 11 respectively. Each via 16 is filled with conductor paste, thus forming vias 17. The chip resistors R are inserted into each inserting hole 15 of each substrate 11, and each substrate is aligned and laminated. Each via 17 of the vertically continued substrates 11 is mutually connected positively, and the chip resistors R and electronic circuits 12 or the electronic circuits 12 of each substrate 11 are mutually bonded electrically.</p> |
