发明名称 LAMINATE FOR MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent deformation of through holes in a laminate body by heating a green sheet, having through holes filled with carbon paste, in an oxidizing atmosphere to remove the carbon paste through burning. CONSTITUTION:A laminate body 1 includes through holes 5 filled with conductive paste for connection between wiring conductors 6, through holes 3 filled with carbon paste, and through holes 4 located near the surface and filled with carbon paste. The laminate body is heated in an oxidizing atmosphere at 400 deg.C for one hour to burn the carbon paste; as a result, the through holes 3 and 4 are emptied. After binder is removed, the laminate body is further heated and burned. The laminate body thus obtained is used as a multilayered printed circuit board, which has through holes and recesses without deformation, and connecting through holes and wiring conductors.
申请公布号 JPH0521958(A) 申请公布日期 1993.01.29
申请号 JP19910176368 申请日期 1991.07.17
申请人 NEC CORP 发明人 HAMAGUCHI HIROYUKI
分类号 H05K3/46 主分类号 H05K3/46
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