| 摘要 |
PURPOSE:To obtain the photosensitive resin composition needing not postbaking at high temperature for a long time, small in decrease of a film, low in cost, and superior in photosensitivity, heat resistance, adhesion, and electric characteristics by incorporating polyparabanic acid and a polymerizable unsaturated compound having a double bond and a photopoly-merization initiator. CONSTITUTION:This photosensitive resin composition is formed by incorporating the polyparabanic acid optionally modifying its terminal by a modifying agent and the polymerizable unsaturated compound having a double bond and a photopolymerization initiator. The polyparabanic acid resin is represented by formula I in which each of Z<1> and Z<2> is O or NH but these are not NH at the same time: R is a group of formula II or the like; and R<1> is H or methyl, thus permitting as useful material to be used for the insulating film of a solid state element, a passivation film, the interlayer insulating film of a semiconductor, and a solder resist. |
