| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To prevent wire deformation by uniforming the pressure of a sealing resin applied on wires with regard to a semiconductor device formed by resin molding. CONSTITUTION:A die stage 2 and inner leads 3 of a lead frame 1 are backed with a bottom part 5 made of an insulating member. A bank part 6 made of an insulating member is formed into a ring outside the bonding position of the inner leads on the lead frame 1.</p> |
| 申请公布号 |
JPH0513619(A) |
申请公布日期 |
1993.01.22 |
| 申请号 |
JP19910160523 |
申请日期 |
1991.07.01 |
| 申请人 |
FUJITSU MIYAGI ELECTRON:KK |
发明人 |
SUZUKI YUSUKE;WATANABE HIDEAKI |
| 分类号 |
H01L21/56;H01L23/28;H01L23/50 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
