发明名称 |
Method for fabricating long array orifice plates. |
摘要 |
<p>A method for electroforming linear orifice plates includes the steps of: placing electrically conductive robber panels adjacent edges of an electrically conductive plating substrate bearing a linear insulative peg pattern; coupling the plating surface of the plating substrate to the adjacent robber panels with a thin strip of electrically conductive material; and electroplating to form an orifice plate with precisely uniform diameter orifices. <IMAGE></p> |
申请公布号 |
EP0523385(A2) |
申请公布日期 |
1993.01.20 |
申请号 |
EP19920110207 |
申请日期 |
1992.06.17 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
SEXTON, RICHARD WILLIAM;HARRISON, JR., JAMES ELMER |
分类号 |
B41J2/135;B41J2/16;C25D1/08 |
主分类号 |
B41J2/135 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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