发明名称 Method for fabricating long array orifice plates.
摘要 <p>A method for electroforming linear orifice plates includes the steps of: placing electrically conductive robber panels adjacent edges of an electrically conductive plating substrate bearing a linear insulative peg pattern; coupling the plating surface of the plating substrate to the adjacent robber panels with a thin strip of electrically conductive material; and electroplating to form an orifice plate with precisely uniform diameter orifices. &lt;IMAGE&gt;</p>
申请公布号 EP0523385(A2) 申请公布日期 1993.01.20
申请号 EP19920110207 申请日期 1992.06.17
申请人 EASTMAN KODAK COMPANY 发明人 SEXTON, RICHARD WILLIAM;HARRISON, JR., JAMES ELMER
分类号 B41J2/135;B41J2/16;C25D1/08 主分类号 B41J2/135
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