| 摘要 |
<p>PURPOSE:To prevent the generation of dust by extruding members for supporting a wafer at several places of the wafer moving and mounting part of an apparatus for mounting the substrate such as the semiconductor wafer and the like and conveying the substrate within a manufacturing apparatus or between manufacturing apparatuses, supporting the wafer with the supporting members, and adding a sucking means for fixing the wafer furthermore. CONSTITUTION:When a wafer 2 is chucked and conveyed, supporting means 4 are provided at several places of a conveying arm 2, and the wafer 1 is supported. Then, the wafer 1 is fixed with a sucking surface 5 for fixing the wafer 1, e.g. with electrostatic sucking and the like.</p> |
