| 摘要 |
<p>PURPOSE:To install a shutter having a simple structure around the shaft of a wafer chuck and to adjust the amount of the air sucked from a gap between the shaft and a cup by adjusting the opening of the shutter regarding the coating apparatus and the coating method of a coating liquid, especially regarding an apparatus and a coating method wherein a wafer is coated with a resist. CONSTITUTION:A coating apparatus is provided with the following: a wafer chuck 2 on which a substrate 5 to be coated is placed; a nozzle 3 used to drop a coating liquid onto the surface of the substrate 5 to be coated; a flow-adjusting plate la which is arranged and installed around the wafer chuck 2 and which adjust the flow of the air around the wafer chuck 2; an evacuation port 1b which evacuates the air; a cup 1 which surrounds the circumference of the wafer chuck 2; and a liquid discharge port 1c which discharges the coating liquid which reaches the cup 1. It is constituted so as to provide a shutter 4 which can adjust a gap 1d between the shaft 2a of the wafer chuck 2 and a hole, in the central part of the cup 1, into which the shaft 2a is inserted loosely.</p> |
