| 摘要 |
<p>PURPOSE:To provide a multilayer printed circuit board, wherein a thermoplastic resin is used as an insulation base material, and the leads of circuit parts can be subjected to soldering, inserted into through holes. CONSTITUTION:In a multilayer printed circuit board, used is a thermoplastic resin as an insulation layer 1, and on its surface and its inner part, provided are respectively required circuit patterns 2, and further, in the board, bored are holes 3 for inserting the leads of circuit parts, which are passed through the board from its surface to its undersurface. In such a multilayer printed circuit board, specifically, a conductive paste layer 7, whose binder is the thermoplastic resin, is provided on the opening section of the hole 3, which is on the undersurface side of the board, extending from the opening section to a required circuit pattern 2a, with which one end of the conductive paste layer 7 is connected. Further, a land 6 for soldering is so formed on the opening section as to contract its diameter. Also, on the opening section of the hole 3 for inserting the leads of circuit parts, wherein the hole 3 is so bored as to be passed through the board from its surface to its undersurface and the opening section is on the undersurface side of the board, conductive paste layers 5, 6, 7, whose binders are the thermoplastic resins, are so provided as to contract the diameter of the opening section, and as to extend from the opening section to the required circuit pattern 2a, with which one end of the conductive paste layers 5, 6, 7 is connected. Therefore, when inserting the lead of the parts into the hole 3 for inserting the lead of the parts and bonding the lead to the conductive paste layer by soldering, between the lead and the conductive paste layer, the solid junction by soldering is performed.</p> |
