| 摘要 |
<p>PURPOSE:To increase the strength of solder junction between L-shaped leads and a printed board of a semiconductor device by improving solder wettability (solderability) on the tip face of a lead. CONSTITUTION:In a lead frame 24 that is an integral body of a plurality of leads 24b arrayed in parallel and coupled each other with tiebars 24c inside a frame 24a, each lead 24b should have a free tip face 24d resulting from cutting the tip face, and side faces of adjacent leads 24b are coupled integrally with auxiliary tiebars 24e in vicinities of free tip faces 24a.</p> |
