发明名称 MOLDING METHOD
摘要 PURPOSE:To shorten the time of molding cycle by setting the initiation time of heating of tablets to become a molded product at the time which is advanced from the prearranged time of clamp-finishing by the actual heating time unit the temperature of the tablets reaches prescribed temperature from the initiation of heating carried out immediately before the heating of the tablets. CONSTITUTION:The top force 11a and the bottom force 11b of molding dies 11 are mutually contacted closely and are clamped, and then the tablets 31N+1 of powderlike thermosetting resin is heated at prescribed temperature. Said tablets are charged in the pot U of the molding dies 11, and then it is pressurized in the pot U and is pushed into the cavity C of the molding dies 11, and further is heat-cured in the state as it is in said cavity, thereby obtaining a molded product. Then the initiation time of heating of the tablets is set at the time which is advanced from the prearranged time of clamp-finishing by the actual heating time until the temperature of the tublets reaches prescribed temperature from the initiation of heating carried out immediately before the heating of the tablets.
申请公布号 JPH05427(A) 申请公布日期 1993.01.08
申请号 JP19910153043 申请日期 1991.06.25
申请人 FUJITSU LTD;FUJITSU MIYAGI ELECTRON:KK 发明人 CHIBA YUJI
分类号 B29C45/02;B29C45/72;B29C45/78;B29K101/10 主分类号 B29C45/02
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