| 摘要 |
A method and apparatus for real-time testing of a Tape Automated Bonded integrated circuit is described. The apparatus is inserted between a test board and a TAB tape integrated circuit. The beams of the assembly are arranged in a pattern similar to the pattern of the electrical contact pads on the test board and the TAB tape. When axial pressure is applied to the test board, the apparatus and the TAB tape, the beams compress and deform, thereby providing a scrubbing contact between the ends of the beams and the contact pads of the TAB tape and the test board. The beams are short in length thereby providing an electrical connection of virtually no impedance interface between the TAB tape and the test board, thereby allowing the intergrated circuit to be tested at AC speed.
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