| 摘要 |
PURPOSE:To realize the microwave band IC package in which many of multi- function microwave band IC chips are mounted without causing deterioration in performance and oscillation or the like and which is operated by a single external power supply (positive voltage power supply only). CONSTITUTION:A chip mount section 20 is made up of a ground section 21 connecting directly to ground by means of a throughhole/side face metallizing or the like and of a floating section 22 insulated from the ground section 21 in terms of DC and coupled with the ground section 21 in terms of a microwave via a capacitive component and the package is operated by a single external power supply (positive voltage power supply only). |
