| 摘要 |
PURPOSE:To obtain a bonding tool capable of shortening wire bonding time for a semiconductor device. CONSTITUTION:A plurality of thin holes 3, 4 are formed in parallel in a wedge 1 (wedge main body 2), through which holes bonding wires are inserted. For example, two thin holes 3, 4 are formed at a necessary interval. A step- difference part 5 corresponding with each thin hole is formed on the base end surface of the wedge 1. Thereby simultaneous bonding of bonding wires inserted into the thin holes is enabled. |
