| 摘要 |
A method of making and the resulting heat exchanger in which there is provided a header plate having a tube receiving opening closely embracing the tube in the opening with a sheet of solder on at least one of the tube and plate adjacent to the opening together with a retainer wettable by the molten solder attached to the tube and plate and bearing against the solder to retain it in position. The assembly of tube, plate, retainer and solder is heated to a melting temperature for the solder with the result that the molten solder flows over the wettable retainer and into the space between the plate and tube by capillary attraction after which the solder is cooled to a solidifying temperature to form a solder joint uniting the tube and header.
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