Method for making multilayer electronic circuits.

摘要

A method for making multilayer electronic circuits comprising the sequential steps of (1) applying to a substrate comprising a plurality of alternating dielectric and conductive layers a thick film dielectric paste containing a low-melting silicate glass; (2) applying to the dielectric paste layer a pattern of thick film conductor paste comprising finely divided particles of silver, an inorganic binder and a ruthenium- or rhodium-based sintering inhibitor, all dispersed in an organic medium; and (3) air cofiring the applied layers of thick film dielectric and conductive pastes. n