| 摘要 |
PURPOSE:To observe the electric operation of an IC chip with a surface conductor by branching a conductor pattern which electrically connects the terminal of an IC chip with the external terminal of an IC package electrically, and connecting the elements with the conductor plate arranged in island shape on the surface of the package. CONSTITUTION:The pad 7 of an IC pad 4 is connected to a package internal pad by a conductive wire 5 for chip-package connection, and the package internal pad 8 is electrically connected with a package external pad 3 via a package internal conductor pattern 2. Furthermore, the package internal conductor pattern 2 is connected to the surface conductor pad 1. Hereby, even with a multipin package with a short terminal width, it becomes possible to perform measurement easily at the time of observation of electric operation by bringing the terminal of the IC package into contact with the conductor plate at the surface of the package with a large contact area. |
