| 摘要 |
PURPOSE:To enable a copper foil pattern and an IC-chip to be directly bonded together with a copper wire or the copper foil patterns to be directly bonded together without a plating treatment by a method wherein a high-heat resistant insulating layer is formed on a metal base. CONSTITUTION:A high-heat resistant insulating resin layer 2 of polyimide resin or aramide resin is formed on a metal base 1, a copper foil circuit pattern 4 is patterned thereon, and a required part is covered with a solder resist 6. Then, an IC chip 8 is die-bonded to the patterned circuit board with Ag paste 9. Thereafter, the electrode pad 5 of the IC chip 6 is directly bonded to the copper foil circuit pattern 4 with a copper wire 3, or the copper foil patterns 4 are directly bonded together with the copper wire 3. By this setup, an IC chip can be bonded to the required part of the copper foil circuit pattern 4 with a copper wire without plating the part concerned with nickel or gold so as to constitute a required circuit. |
