| 摘要 |
PURPOSE:To increase the tensile strength of a bonding wire which connects a semiconductor chip and a lead frame. CONSTITUTION:The title semiconductor device is constituted of the following; a lead frame 2, a semiconductor chip 3 die-bonded to the lead frame, a bonding wire 7 having a conical recess at the central part on the semiconductor chip 3, an aluminum wire 6, a passivation film 5, and resin seal material 1. Since a bonding pad which connects the lead frame 2 and the semiconductor chip 3 has the conical recess at the central part, a ball of the bonding wire 7 is connected without being crushed. Hence the contact area between the bonding pad and the bonding wire 7 is increased, and the tensile strength of the bonding wire 7 is improved. |
