| 摘要 |
PURPOSE:To provide a semiconductor chip joining method which can reduce the occurrence of voids by improving the adhesion of a solder foil to a lead frame. CONSTITUTION:In a process of welding a semiconductor chip with a lead frame 3 by solder, a solder foil 2 is pressure-welded to a lead frame 3 by a press mechanism 7 so as to improve the adhesion between the lead frame and the solder foil 2, and then the solder is fused weld the semiconductor chip to it. |
