| 摘要 |
PURPOSE:To provide a method of forming bump electrodes on a semiconductor chip by arranging conductive particles on electrodes arranged on the semiconductor chip. CONSTITUTION:Only an electrode 2 on a semiconductor chip 1 is coated with an adhesive 5 by screen printing. Conductive particles 4 are sprayed onto the semiconductor chip 1 by means of compressed air, so that particles 4 are deposited only on a tacky adhesive 5, thereby forming bump electrodes on the semiconductor chip. |
