发明名称 HYBRID INTEGRATED CIRCUIT FOR HIGH FREQUENCY MICROWAVE AND ITS MANUFACTURE
摘要 PURPOSE:To realize a high frequency microwave use hybrid integrated circuit miniaturized entirely by arranging a semiconductor chip and an integrated circuit chip to a recessed part in which a ground conductor is exposed. CONSTITUTION:A ground conductor 2 is inserted between a base 9 and a thin base 8 in a transmission line section 3 such as a microstrip line, a recessed part 10 on which the ground conductor 2 is exposed to the thin base 8 and a circuit chip 6 is arranged to the recessed part 10. Thus, while the characteristic impedance is kept to a prescribed value, the conductor 4 is decreased and the projection of a semiconductor and integrated circuit chip 6 and a lead wire 7 from the transmission line 3 such as the microstrip line is reduced, then the entirely small sized high frequency microwave use hybrid integrated circuit is realized.
申请公布号 JPH04363901(A) 申请公布日期 1992.12.16
申请号 JP19900317919 申请日期 1990.11.26
申请人 MITSUBISHI MATERIALS CORP 发明人 NOSE TSUNETARO;FUKUMURA MORIFUMI
分类号 H01L23/12;H01P3/08;H01P5/08;H01P11/00;H03F3/60;H05K1/02 主分类号 H01L23/12
代理机构 代理人
主权项
地址