发明名称 |
HYBRID INTEGRATED CIRCUIT FOR HIGH FREQUENCY MICROWAVE AND ITS MANUFACTURE |
摘要 |
PURPOSE:To realize a high frequency microwave use hybrid integrated circuit miniaturized entirely by arranging a semiconductor chip and an integrated circuit chip to a recessed part in which a ground conductor is exposed. CONSTITUTION:A ground conductor 2 is inserted between a base 9 and a thin base 8 in a transmission line section 3 such as a microstrip line, a recessed part 10 on which the ground conductor 2 is exposed to the thin base 8 and a circuit chip 6 is arranged to the recessed part 10. Thus, while the characteristic impedance is kept to a prescribed value, the conductor 4 is decreased and the projection of a semiconductor and integrated circuit chip 6 and a lead wire 7 from the transmission line 3 such as the microstrip line is reduced, then the entirely small sized high frequency microwave use hybrid integrated circuit is realized. |
申请公布号 |
JPH04363901(A) |
申请公布日期 |
1992.12.16 |
申请号 |
JP19900317919 |
申请日期 |
1990.11.26 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
NOSE TSUNETARO;FUKUMURA MORIFUMI |
分类号 |
H01L23/12;H01P3/08;H01P5/08;H01P11/00;H03F3/60;H05K1/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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