| 摘要 |
PURPOSE:To connect the terminal of electronic equipment to the wiring pattern of a board by strengthly and electrically excellent solder connection by restricting the thermal deformation of a board. CONSTITUTION:When soldering the terminal 11 of electronic equipment 10 to the wiring pattern on a board 12, the electronic equipment 10 is pressed down from above with a pusher 20, and the rear of the board 12 is supported from below with a pressure head 40. In this condition, the connection between the wiring patter supplied with solder and the terminal 11 is irradiated with a light beam 13. Since the board 12 is caught from both sides with the pusher 20 and the pressure head 40, the thermal deformation caused by the temperature rise during soldering is restricted, and the flatness of the board 12 never deteriorates after soldering. Moreover, since the positional relation between the wiring pattern and the terminal 11 is maintained accurately, favorable soldering becomes possible. |
