| 摘要 |
PURPOSE:To enhance the quality of a semiconductor device by adopting solder material capable of evenly and sufficiently wet-expanding as a solder for soldering semiconductor chip to a supporter. CONSTITUTION:Solder materials 2 are mounted on a diepad 1 as a supporter whereon a semiconductor chip is fixed. The diepad 1 is heated in melted down state at the temperature exceeding the melting point of the solder materials 2 so that a semiconductor chip may be pressed down and then cooled down to be fixed on the supporter 1. At this time, the solder material 2 of a fine wire having a circular section is cut in single or multiple pieces.
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