| 摘要 |
PURPOSE:To dissipate heat from an IC chip in a simple constitution without the installation of such an equipment as a heat sink, etc. CONSTITUTION:A package 4 is filled up with fluorine based inert liquid 1 so as to immerse an IC chip 6 therein. Accordingly, the heat dissipated by the IC chip 6 can be sufficiently absorbed by the fluorine base inert liquid 1 together with any oscillation or shock. |
