| 摘要 |
<p>The areas of a printed circuit where electrical components are to be solder connected, such as through-holes (H), surrounding pads (P) and surface mount areas (SMT), are selectively provided with a metal coating (22) (e.g., tin-lead) which preserves and promotes solderability thereat, by a process in which a photoimageable electrophoretically deposited organic resin (20) is used to provide, on an already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged. <IMAGE> <IMAGE> <IMAGE></p> |
