| 摘要 |
PURPOSE:To provide a photosensitive thermosetting resin compsn. suitable for the production of printed circuit boards and the like and to offer the formation method of patterns. CONSTITUTION:The photosensitive thermosetting resin compsn. contains the following components (a)-(d) as essential components. (a) Photosensitive oligomers obtd. by effecting the reaction of alpha,beta-unsatd. monocarboxylic acid ester having alcohol type hydroxyl groups expressed by formula I with polymers and/or copolymers obtd. by adding alpha,beta-unsatd. dicarboxylic acid anhydride to polymers and/or copolymers of conjugated dienes having 500-5000 number average mol.wt. so that at least >=80mol% of the acid anhydride group of the additional compd. is subjected to open-ring reaction. (b) photopolymn. initiator, (c) epoxy resin having two or more epoxy groups in the molecule, and (d) 2,4- diamino-6-vinyl-S-triazine. In formula I, R<1> and R<2> are hydrogen atom or org. residues of 1-6 carbon number, R<3> is an alkylene group of 2-12 carbon number. |
