| 摘要 |
<p>PURPOSE:To execute a uniform treatment without having fluctuations in temp. CONSTITUTION:A semiconductor wafer 3 is supported in a 1st supporting section 10 at the time of feeding in the semiconductor wafer 3. The 1st supporting section 10 has a temp. regulating means, is formed of a material having, for example, a good thermal conductivity and regulates the temp. of the semiconductor wafer 3 to room temp. The semiconductor wafer 3 is sucked and imposed in the 2nd supporting section 11 and is treated under rotation. Then, the temp. of the semiconductor wafer is regulated just before the treatment and the uniform treatment is executed with high accuracy.</p> |
