发明名称 RESIN MOLDED ITEM BY SANDWICH MOLDING METHOD
摘要 PURPOSE:To reduce manufacturing costs by making the wall thickness of a molded item of resin thinner to reduce the weight thereof, while the rigidity thereof is being held, and reducing manufacturing processes. CONSTITUTION:A side garnish 1 is formed from a core layer 2 made of hard PP material 2a by a sandwich molding method and a skin layer 3 made of soft PP material 3a applied onto the outer periphery of the layer 2. The rigidity of the garnish is held by the core layer 2, while adhesion of coating material is improved by the skin layer 3.
申请公布号 JPH04353414(A) 申请公布日期 1992.12.08
申请号 JP19910129948 申请日期 1991.05.31
申请人 TOYODA GOSEI CO LTD 发明人 MUKAI HIROSHI;SATO TAKAHIKO
分类号 B29C45/16;B29K23/00;B29K105/06;B29L31/30;B32B27/32;B60R13/04 主分类号 B29C45/16
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